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LED/LCD TV application decomposition diagram
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GC-TP Series Thermal Pad is used for filling and heat conduction between aluminum cast heat sink parts (or aluminum stamped heat sink parts) and TCP IC.
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| Thermally conductive material: Thermal double-sided tape | Main heating elements: Electronic originals such as CPU, ADSL chip, and switch chip | Application Environment: Filling heat conduction between the chip and the heat sink |
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